Fast 3D CT Automated X-Ray inspection, with a resolution of 3um, capable of dividing a single solder joint into hundreds of cross-section slices for individual measurement and analysis.
A high resolution 3D CT scan with the VT-X750 cuts hidden solder joints into hundreds of cross-section slices within a matter of seconds. The ability to isolate individual layers allows the automated inspection algorithms to measure a variety of features without the shadowing or interference of components on the opposite side (including Head-in-Pillow and voiding defects). Omron’s offline repair and programming software also reduces the need to interrupt production and allows users to make adjustments on the fly.
| Specifications | |
|---|---|
| Technology | 3D CT |
| Model: | VT-X750-V3.0-CR | VT-X750-V3.0-CV | VT-X750-V3.0-HR |
|---|---|---|---|
| Resolution | 3um-30um | 3um-30um | 6um-30um |
| Technology | 3D CT | 3D CT | 3D CT |
| Board Handling | 50x50mm - 610x515mm | 50x50mm - 610x515mm | 50x50mm - 610x515mm |
| Board Weight | <4kg, <8kg | <4kg, <8kg | <4kg, <8kg |
| Detector Size | Large | Normal | Large |
| Model: | VT-X750-V3.0-HV | VT-X750-XL |
|---|---|---|
| Resolution | 6um-30um | 10um-30um |
| Technology | 3D CT | 3D CT |
| Board Handling | 50x50mm - 610x515mm | 100x50mm - 1200x610mm |
| Board Weight | <4kg, <8kg | <15kg |
| Detector Size | Normal | Normal |