VP9000 Series Solder Paste Inspection Machine
3D AOI
VP9000 – 3D Solder Paste inspection with multiple resolution and configuration options to best meet the needs of the application.
The VP9000 uses highly accurate and repeatable 3D imaging to perform complete PCB solder paste analysis. Potential PCB warpage is calculated at each inspection point and automatically compensated for prior to analysis. The combination of features achieves ultra-precise volume measurements with an accuracy within 2%.
| Specifications | |
|---|---|
| Accuracy | Volume within 2% |
| Optical Resolution | 25/12.5/8.5um, 20/10/7.5um, 15/7.5/5um |
| Technology | Single or Dual Projector, True 3D SPI |
| Model: | VP9000 | VP9000L | VP9000LD |
|---|---|---|---|
| Technology | Single or Dual Projector, True 3D SPI | Single or Dual Projector, True 3D SPI | Single or Dual Projector, True 3D SPI |
| Accuracy | Volume within 2% | Volume within 2% | Volume within 2% |
| Optical Resolution | 25/12.5/8.5um, 20/10/7.5um, 15/7.5/5um | 25/12.5/8.5um, 20/10/7.5um, 15/7.5/5um | 25/12.5/8.5um, 20/10/7.5um, 15/7.5/5um |
| Board Handling | 50mm x 50mm, 250mm x 330mm | 50mm x 50mm, 460mm x 510mm | 50mm x 50mm, 510mm x 330mm |